Micron Technology’s latest memory offering is a collaboration with Intel to address memory-intensive data center applications like AI and high-performance computing (HPC).
Micron presented its multiplexed rank dual inline memory modules (MRDIMMs). This first generation of MRDIMMs will enable customers to run increasingly demanding workloads with support for a wide capacity range from 32 GB to 256 GB in standard and tall form factors (TFF), which are suitable for high-performance 1U and 2U servers, and are compatible with Intel Xeon 6 processors.
For applications requiring more than 128 GB of memory per DIMM slot, Vaidyanathan said Micron MRDIMMs outperform current TSV RDIMMs, while the TFF modules feature an improved thermal design that reduces DRAM temperatures by up to 20 degrees Celsius at the same power and airflow to enable more efficient cooling in the data center.
Over the last decade, compute performance has been delivered through rapid growth in core count to grow system bandwidth, but the challenge has been maintaining bandwidth per core and getting it to curve upward. The MRDIMM is Micron’s effort to reduce the decline in bandwidth per core, he added.
Compared with RDIMMs, MRDIMMs increase in effective memory bandwidth as much as 39% and latency by 40%, while offering 15% better bus efficiency.
Micron and Intel confirmed that its MRDIMM product would be in alignment with industry standards—it implements DDR5 physical and electrical standards that scales both bandwidth and capacity per core to future-proof compute systems.
The Intel/Micron launch came out ahead of the JEDEC Solid State Technology Association revealing key details about its upcoming standards for DDR5 MRDIMMs, which it said would enable applications to exceed DDR5 RDIMM data rates. Other planned features in the JEDEC MRDIMM standard will include platform compatibility with RDIMM for flexible end-user bandwidth configuration, use of standard DDR5 DIMM components like DRAM, DIMM form factor and pinout, serial presence detect (SPD), power management integrated circuits (PMIC), and temperatures sensors (TS) for ease of adoption.
JEDEC said there are also plans to support the tall MRDIMM form factor to offer higher bandwidth and capacity without changes to the DRAM package. By going taller, it is possible to enable twice the number of DRAM single-die packages to be mounted on the DIMM without the need for 3DS packaging.
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Gary Hilson is a freelance writer with a focus on B2B technology, including information technology, cybersecurity, and semiconductors.