AI-Driven HBM Uptake Is Power-Sensitive [Byline]

High-bandwidth memory (HBM) has become the artificial-intelligence memory of choice, and as HBM3 goes into volume production, more attention is being paid to power consumption in the wake of 2023’s generative AI boom.

The increasing demand for memory bandwidth from AI is directly correlated to increasing HBM bandwidth.Performance needs, memory bandwidth and memory sizes are growing exponentially, putting higher expectations and pressure on the next generation of HBM.

While bandwidth per watt as it relates to HBM is not particularly new, he said, energy consumption by data centers has been on the rise. These rapidly increasing power costs mean that bandwidth per watt is becoming a more important metric for enterprises who need to monitor operational costs—even more so with the increasing focus on sustainability initiatives.

The high costs associated with HBM and the price tag of the memory itself means the total cost of ownership becomes the deciding factor when determining if this uber-power memory is necessary for application. The process for customers to decide which memory they need starts with technical requirements like density, performance and power.

Read my full story for EE Times.

Gary Hilson is a freelance writer with a focus on B2B technology, including information technology, cybersecurity, and semiconductors.

Flash File Fragmentation Needs A Fix for Automotive [Byline]

Gone are the days of having to manually defrag your hard drive because it’s done automatically, and flash doesn’t experience file fragmentation. Or does it?

It may be that your smartphone is running slow because it can’t keep up with software updates and bloating, but that its flash storage is experiencing file fragmentation. Joel Catala, director of Embedded Solutions at Tuxera, said that contrary to popular belief, fragmentation can significantly affect performance of a flash device. Recent research suggests that as flash storage hardware gets faster, the software I/O stack overhead is an I/O performance bottleneck, he said in a telephone interview with EE Times. It’s not the flash or the controller responsible for the bottleneck.

Read the full EE Time story.

Gary Hilson is a freelance writer with a focus on B2B technology, including information technology, cybersecurity, and semiconductors.

DRAM Boom and Bust is Business as Usual [Byline]

Boom or bust. It’s long been the cycle for established memory technologies. As 3D NAND pricing softens, DRAM still appears to be going strong. But for how long? And will these ups and downs always be the norm despite diversified demand and emerging vendors from China?

One key characteristic of the DRAM market is that there are currently only three major suppliers — Micron Technology, SK Hynix and Samsung Electronics.

“They’re keeping a pretty tight rein on their capacity,” said Brian Matas, vice president of market research at IC Insights, said in a telephone interview with EE Times. “And at the same time, there’s also pretty strong demand for higher performance and higher-density parts, particularly from the data center and server applications.”

Read my EE Times story.

Gary Hilson is a freelance writer with a focus on B2B technology, including information technology, cybersecurity, and semiconductors.