Light-emitting diodes (LEDs) are getting smaller, but the process to make them small isn’t easy – at least not yet.
Not unlike many semiconductor technologies, including emerging memory devices, making LEDs smaller is possible, but not always cost effective. The LEDs found in your average flatscreen TV are a mature technology, but manufacturing microLEDs still has its growing pains.
The potential for microLEDs is broad and goes beyond flat panel televisions and smaller displays for smartphones and automotive – there are some interesting medical applications, too.
Cloud computing raised expectations for data speeds, but artificial intelligence (AI) workloads are placing even more pressures on bandwidth to move data faster and reliably.
While protocols like the Compute Express Link (CXL) are helping to optimize where data is stored so it is closer to where it needs to be, connectivity remains crucial to moving it as fast as possible. After a dip in adoption, optical transceiver technology is seeing an uptick to scale AI in the data center by companies like Amazon and Google, while connectivity is getting baked into full-stack systems along with hardware and software.
TORONTO — Testing various electronics components such as memory to make sure that they can withstand the rigors of the automotive environment has long been standard operating procedure. But today’s smarter cars and emerging autonomous vehicles must be put through their paces as a complete package.
In Europe, this can now be done at the AstaZero 5G test facility, a joint venture of Swedish state-owned Research Institutes of Sweden (RISE) and Chalmers University. In a telephone interview with EE Times, AstaZero CEO Peter Janevik said that it’s the most advanced testing environment for self-driving vehicles, designed to provide the data necessary to predict vehicle behavior in real-life situations without the need for on-the-road testing.
TORONTO — Only months after announcing it would slowly wind down its 3D Xpoint collaboration with Micron Technology, Intel Corp. has outlined where it sees the persistent memory delivering the most benefits.
Its latest data center strategy includes two new members of its Xeon process family. The Xeon E-2100 processor is available immediately, while its Cascade Lake advanced performance processor will be released in the first half of next year.
The E-2100 processor is aimed at small- and medium-size business and cloud service providers to support workloads on entry-level servers, as well as across all computing segments for sensitive workloads that need enhanced data protections. Cascade Lake, however, is a new class of scalable Xeon processor, said Lisa Spelman, vice president and general manager of Intel Xeon products and data center marketing.
If getting your IT systems to support privacy legislation is your jam, you’re going to love the latest update to the Personal Information Protection and Electronic Documents Act (PIPEDA). Better yet, you can apply your experience meeting the General Data Protection Regulation (GDPR) to your compliance efforts.
Read my closer look at what’s involved in this update and what steps you can take to remain compliant over at Tektonika.
TORONTO — It’s always been assumed that quantum computing is better — at least to the layperson. But IBM research scientists have now actually proven mathematically that quantum computing is faster than a classical computer for certain problems.
The critical word, however, is “certain.” In a telephone interview with EE Times, Bob Sutor, vice president of IBM Q Ecosystem and Strategy, said this mathematical proof demonstrates concretely the difference between certain types of computations that can be done with a quantum computer versus a classical computer.
TORONTO — Emerging use cases are revealing the many ways memory technologies can be an avenue for threat actors to create havoc, whether for stealing data or sending malicious instructions.
Security features in memory aren’t new, of course. The “s” in SD card initially stood for “secure,” but the SD Association hasn’t really emphasized it for a decade, while electrically erasable programmable read-only memory (EEPROM) has long been used for applications that need embedded security such as credit cards, SIM cards and key-less entry systems, among others.
But as different kinds of memory are put into a wider variety of systems — such as automotive, manufacturing and the Internet of Things (IoT) — the need for security has greatly increased. The question is not only where that security will be integrated, but how it will be managed, especially in embedded memories that are expected to remain in a device for years, possibly decades.
Gone are the days of having to manually defrag your hard drive because it’s done automatically, and flash doesn’t experience file fragmentation. Or does it?
It may be that your smartphone is running slow because it can’t keep up with software updates and bloating, but that its flash storage is experiencing file fragmentation. Joel Catala, director of Embedded Solutions at Tuxera, said that contrary to popular belief, fragmentation can significantly affect performance of a flash device. Recent research suggests that as flash storage hardware gets faster, the software I/O stack overhead is an I/O performance bottleneck, he said in a telephone interview with EE Times. It’s not the flash or the controller responsible for the bottleneck.
Last year was the worst year to date for cyber attacks, but many predict 2018 will be even worse.
Given how 2018 is going so far, that’s not hard to believe. The frequency of high-profile breaches is only increasing, and the payouts hackers enjoy are getting bigger. In an environment where cybercrime prevention can feel like a losing battle, how can you help your company stay secure?
oom or bust. It’s long been the cycle for established memory technologies. As 3D NAND pricing softens, DRAM still appears to be going strong. But for how long? And will these ups and downs always be the norm despite diversified demand and emerging vendors from China?
One key characteristic of the DRAM market is that there are currently only three major suppliers — Micron Technology, SK Hynix and Samsung Electronics.
“They’re keeping a pretty tight rein on their capacity,” said Brian Matas, vice president of market research at IC Insights, said in a telephone interview with EE Times. “And at the same time, there’s also pretty strong demand for higher performance and higher-density parts, particularly from the data center and server applications.”