TORONTO — Only months after announcing it would slowly wind down its 3D Xpoint collaboration with Micron Technology, Intel Corp. has outlined where it sees the persistent memory delivering the most benefits.
Its latest data center strategy includes two new members of its Xeon process family. The Xeon E-2100 processor is available immediately, while its Cascade Lake advanced performance processor will be released in the first half of next year.
The E-2100 processor is aimed at small- and medium-size business and cloud service providers to support workloads on entry-level servers, as well as across all computing segments for sensitive workloads that need enhanced data protections. Cascade Lake, however, is a new class of scalable Xeon processor, said Lisa Spelman, vice president and general manager of Intel Xeon products and data center marketing.
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TORONTO — What the future holds for 3D XPoint — now that Intel and Micron have announced plans to end their joint development program — depends on who you talk to.
Or who you don’t talk to. Micron, for its part, isn’t offering any more guidance right now beyond what was stated in a joint news release issued earlier this week. “The companies have agreed to complete joint development for the second generation of 3D XPoint technology, which is expected to occur in the first half of 2019,” the statement reads. “Technology development beyond the second generation of 3D XPoint technology will be pursued independently by the two companies in order to optimize the technology for their respective product and business needs.”
Intel is still bullish on the technology. In a telephone interview with EE Times, Bill Leszinske, vice president of Intel’s non-volatile memory solutions group, said it makes sense for Intel to continue on its present path.
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