The Hybrid Memory Cube Consortium (HMCC) is making steady progress on bringing one of the most discussed heirs to DDR4 closer to reality by releasing an update to the HMC specification late last month. The first draft of the second-generation specification supports increased data rates that advance short-reach (SR) performance from 10 Gbit/s, 12.5 Gbit/s, and 15 Gbit/s, up to 30 Gbit/s. Read Full Article.
Tag: ee times
RONNIEE Card Shares Memory Across Networks [Portfolio]
Startup A3Cube recently announced a new network interface card, dubbed RONNIEE Express, designed to eliminate the I/O performance gap between CPU power and data access performance for datacenters, big data, and high-performance computing applications. The company said that by turning PCI Express into an intelligent network fabric, it can exceed existing networking technologies such as Ethernet, InfiniBand, and Fibre Channel, and improve memory latencies. Read my full story on EE Times.
EE Times Roundup: Next Generation Memory [Portfolio]
There are a number of next generation memory technologies on the horizon that hold great promise to meet the evolving needs of consumer devices and enterprise storage systems and applications. Some have been in development for a number of years, and are close to a critical turning point that will see them widely adopted. Here’s a few that merit watching in the next year, including several DRAM alternatives. Read my full article on EE Times.
Deduplication & Compression Extend SSD Lifespans [Portfolio]
NEWARK, Calif. – The higher costs of SSDs (relative to spinning disks) and their lifespan limitations generally keep enterprises from fully embracing them for storage. The ongoing challenge is how to optimize them to get the best bang for the buck, while also addressing the endurance problem. Read the full article on EE Times.
Group Forms to Drive NVDIMM Adoption [Portfolio]
SAN JOSE, Calif. — The Storage Networking Industry Association (SNIA) has created a special interest group to foster the adoption of nonvolatile DIMM (NVDIMM), which it sees as the early days of computing architectures that combine storage and memory as a single entity. Read my full article on EE Times.
Flash Dominates Awards at Storage Visions 2014 [Portfolio]
LAS VEGAS — Memory architectures, SSDs, and flash technology were well represented at this year’s Storage Visions conference, including the show’s awards that highlighted visionary companies and products.
Among the award winners was Samsung, which nabbed the Professional Storage Company award for its introduction of 3D Vertical NAND Flash Technology. Read my full article in EE Times.
SanDisk Ships Enterprise-Grade ULLtraDIMM SSDs [Portfolio]
TORONTO — SanDisk has officially started shipping its anticipated ULLtraDIMM Solid State Drive (SSD) with select enterprise servers, describing the ultra-low latency drive as an industry first. The ULLtraDIMM SSD leverages Diablo Technologies’ memory channel storage (MCS) architecture. SanDisk’s ULLtraDIMM can be integrated into an existing DIMM slot, and additional SSDs can also be added to available DIMM slots. Read my full article on EE Times.
USB Flash Drives Still Have (a Little) Life Left in Them [Portfolio]
I rarely find use for my accumulated USB thumb drives thanks to cloud services and ubiquitous networking, but a few companies still see potential in a form factor that’s seen declining growth in recent years. Read my full blog post on EE Times.
Samsung Aims SSD Encryption at Enterprise Environments [Portfolio]
LAS VEGAS – Samsung has added new security features to its self-encrypting drive (SED), the 840 EVO SSD, making it compatible with professional security software employed by enterprise organizations, and positioning the company for what it expects is a market where encrypted SSDs are standard. Read my full article on EE Times.
DDR4 Gets Update Before Getting Much Uptake [Portfolio]
Depending on who you talk to, DDR4 memory may be available now, this spring, or not until the end of the 2014. Companies such as Samsung and SK Hynix began manufacturing their first DDR4 chips in early 2011, prior to the release of the JEDEC DDR4 DRAM standard in September 2012, and there are offerings out on the market available to design engineers. Micron-owned memory maker Crucial, for example, initially announced plans to sell DDR4 as early as December, but now commercial availability of its new DDR4 modules is not expected until the spring. Read my full article on EE Times.